分公司经理英文简历表格

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第1篇:分公司经理英文简历表格

分公司经理英文简历表格

简历最开始并不是用来阅读的,至少在开始的时候是这样。他们首先会被扫描、打分然后分类。其次,一份好的简历对于让你能否最终得到这份工作并不是最重要的。它仅仅只是在搞定面试的这个阶段显得至关重要。再次,简历的.真正目的就是在于能够吸引某个人的注意力。人力资源部门使用简历作为工作匹配工具。他们努力的以这种方式寻找人选,希望可以找到合适的人才。

以下是*****小编分享的分公司经理英文简历表格,更多内容请访问(jianlli.*****.com)。

Name:*****Hukou:
Residency:Work Experience:
Current Salary:rTel:
E-mail:www.ruiwen.com/jianli
Career Objective
Desired Industry:
Desired Position:Director ,Chief Representative ,Branch Office Manager
Desired address:ShanghaiDesired Salary:
Work Experience
2007/06—Present***Company
Industry: Electronics/Semiconductor/IC

Quality QA/QC Manager

Responsibilities:

On-time delivery of quality products.Daily monitoring of actual quality and quality reports.Controlling and reducing quality cost while maintaining or improving quality thru training programs, cross training of workers, process improvement together with production or suppliers.Ongoing interaction with production department to fully implement any required quality improvements.Daily communication with VP in US on quality issues.Report Directly to: US operation VP

Reason for Leaving: family factor

2005/12—2007/03Liteon semiconductor
Industry: Electronics/Semiconductor/IC

Quality Reliability Assurance QRA director

Responsibilities:

Manage the department Goal and Objective Planning (KPI)in QC, QA, QS, EHS, RoHS, lab section. Coordinate cross department activities & problem solving.Lead cooperate business plan and strategies review and optimization.Lead cooperate supply chain management to secure raw material delivery & quality assurance & supply base development.In cooperate level take part in the NPD and NPI project setup & executions.Lead NPD qualification through APQP and PPAP.Lead top management review of quality-oriented production performance.Lead CQE team in response to customer complaints and problem solving to achieve total customer satisfaction.Securing product, process change control and systematically retaining documented knowledge (including SOP, standards, specifications, PCN, ECN) within the organization.Report Directly to: General Manager Number of Subordinate:116

Reason for Leaving: business depression & working environment

Achievements:

RoHS system build-up and optimization.40% reduction of customer quality complaints.Top 3 ranking of OEM customer satisfaction (ST, on semi).Lead re-certificate of ISO14000 and TS16949.Reliability engineering capability build-up to support NPD project to win time-to-market.Get quality system audit success from Sony, Samsung, LG, and Omron to gain business opportunity.CQE and supply chain management system setup.

2004/03—2005/08“On” semiconductor (Spun off from Motorola)
Industry: Electronics/Semiconductor/IC

Strategic product Engineering Product Engineering Manager

Responsibilities:

Take initiative to set up and manage strategic product engineering team and coordinate 3 cooperate business units NPD and NPI projects in Asia pacific region through joint technical and marketing efforts with counterparts in cooperate level worldwide. The task included Marketing analysis, new product development & introduction, process and productivity improvement, new package & test development, continuous manufacture cost-down campaign etc. All of them are strictly in compliance with cooperate strategy “time to market” and “profit margin maximum” to reinforce company competitiveness in dynamic market environment.In order to fulfill technical support need to local key customers and further R&D requirement of testing capability and capacity I independently handle new characterization lab establishment covering complicated budget review, equipment list definition, logistic issue forecast, lab layout preparation, subcontractor selection, facility construction management, regular quality audit, final inspection and qualification etc. working with HR on lab engineer hiring process.Closely collaborate with application and customer quality engineer in customer-orientated manner on product complaint and quality issue feedback, technical consultation of diversified IC category etc.Strategic outsourcing activities including supplier assessment, screening, management. Integrate supplier technical expertise into stepping up company business profit margin; cost reduction, product competitiveness etc.Reason for Leaving: organization change

2003/06—2004/02Grace Semiconductor Manufacture Cooperation
Industry: Electronics/Semiconductor/IC

QRA Engineering Senior Engineer leader

Responsibilities:

To be partner with technical development organization and take leadership to conduct total qualification projects of advanced process reliability of CMOS technology. Take use of various quality analysis tools on process stability & normal deviation, evaluation of product lifetime, yield indicator like Cp, Cpk etc. take ownership to write up a set of official qualification reports in line with requirement of ISO9001 and QS9000 as well as customer justification requirement.Solid hand-on experiences on various reliability tests in lab and take management role of equipments and lab staffs on my own.Working with FA sector to do failure analysis experiment to dig out root cause of low performance of in-line process. Failure mechanism study is essential to reveal drawback in new technology development process and provide improvement advice and approach to R&D staffs.Act as single technical contact window with customers with advice related to product reliability issue. Demonstrate product quality level to customer from reliability performance aspect to build up confidence and attract more orderings.Supply management to support IC package and other consuming material purchase in daily mass reliability tests.People performance management.Reason for Leaving: personal development

1998/02—2003/06Intel
Industry: Electronics/Semiconductor/IC

Test & Assembly Engineering Engineer leader

Responsibilities:

Management in testing & assembly operation setup for three new factories startup.Manage NPI and NPD projects in wide cooperation with test & Assembly & product engineering teams around Asia pacific region and in USA.Supplier management to drive continuous cost reduction in high volume manufacturing and new material development for NPI and NPD.Customer technical support on product issues.Testing & assembly team management to drive various kinds of engineering projects to achieve the quality continuous improvement & productivity increase & cost saving.ISO9000 certification.Reason for Leaving: personal development

1993/09—1998/02Shanghai textile hardware Factory
Industry: Machinery, Equipment, Heavy Industries

Technical Engineering Electrical Engineer leader

Responsibilities:

NPI project (10 million RMB) management with one year oversea working experience. The project covered business and technical negotiation including CNC machine & tool procurement, Process technique transfer, Automatic production line setup & qualification & pilot run & mass production.Equipment line & people management for troubleshooting and maintenance.NPD management with CAD design & CNC programming & first article qualification.Customer management on product quality & application issues.Supplier management for spare part & raw material localization & cost-reduction projects.Reason for Leaving: personal development

Education and Training
2002/03—2005/01Fu Dan University Microelectronics Master
1998/09—2001/07Shanghai Jiao Tong University Computer Application Bachelor
1990/09—1993/07Shanghai Textile Academy Electrical Engineering and Automation
2004/11—2004/12Internal training People hiring and management
2002/03—2002/05Internal training Finance and business management basic
1999/05—2000/02Internal training Total Quality Management
Professional Skills
Language Skills:English: VERY GOOD
Self-appraisal
Self-motivated fast learner team work spirit good team leadership strict discipline sense good interpersonal skill.

第2篇:分公司经理求职英文简历表格

分公司经理求职英文简历表格

用人单位在招聘期间也会收取到大量的个人简历,求职者也需要了解在职场中击败竞争对手的方式,比如说利用个人简历来击败对手。那么,求职者又该如何利用个人简历击败竞争对手呢?

在求职的过程中个人简历起到怎样的作用,在竞争方面又能起到怎样的作用,这是更好利用个人简历的来在竞争中为自己加分,进而才能在有效的击败竞争对手。在编写个人简历之前,也要根据个人简历的.作用,来从中领悟到个人简历的竞争力包括有哪些方面,像是个人简历整体外在形象、个人简历的基本内容,还有个人简历中所突出的重点部分等等,这些都是可以作为竞争优势。

利用个人简历来击败竞争对手,简单来说就是通过个人简历来顺利的获得求职面试的机会,从而来提高求职成功率。在这里个人简历能够顺力的通过筛选,也就是人通过其高品质的简历效果。编写出高质量的个人简历,一来要能够的明确的指导什么样的个人简历更具有吸引力,二来要学习个人简历的写作技巧,尤其是在语言的使用方面。

Name:*****Sex:
Date of Birth:Hukou:
Residency:Work Experience:
Current Salary:Tel:
E-mail:www.ruiwen.com/jianli
Career Objective
Desired Industry:Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification
Desired Position:Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff
Desired address:Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary:Negotiable
Work Experience
2006/06—Present***Company
Industry: Electronics/Semiconductor/IC

Intel Flash Engineering Department Individual Contributor

Responsibilities:

I have been working in Intel Flash Assembly & Test Engineering

Department as an Individual Contributor since June of 2006.

Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:

1.The yield of year 2006 has been dramatically increased than that of year 2005.

2.The yield of all products, consecutively meets the goal.

3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.

Report Directly to: Department ManagerNumber of Subordinate: 14

Reference: Bao Powel

Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.

Our efforts are paid off:

1.The yield of year 2006 has been dramatically increased than that of year 2005.

2.The yield of all products, consecutively meets the goal.

3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.

2006/01—2006/05Intel(Shanghai) Technology Development Ltd. Company
Industry: Electronics/Semiconductor/IC

Intel STTD-China Department Electronics Development Engineer

Responsibilities:

1.I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.

2.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.

Report Directly to: Hopman MarkNumber of Subordinate: 14

Reference: Bao Powel

Reason for Leaving: I was transferred to Intel(Shanghai)Products Ltd. Company due to the internal re-organization in June of 2006.

Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.

2005/05—2006/01Nanyang University of Science & Technology
Industry: Electronics/Semiconductor/IC

Electronics & Electrical Engineering Department Research Fellow

Responsibilities:

1.I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.

2.I majored at Gate Oxide Reliability Research in the duration.

Report Directly to: Professor Pey Kin Leoh

Subordinate: 3

Reference: Patrick Low

Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.

Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.

Project Experience
2008/01—PresentAssembly NPI (New Product Introduction)
Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.

Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.

2007/01—2007/12Marginal Electrical Boards Rescue
Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.

Responsibility: Being the team leader, I took the job of data analysis, define each members role, make program plan, coordinate each team member and follow up the progress.

2006/10—2007/05Optimization the current Test Process Order for Flash Memory
Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.

Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.

2006/05—2006/12Test Yield of Flash memory Improvement
Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.

Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.

Education and Training
2005/05—2006/01Nanyang University of Science & Technology Microelectronics Doctorate
I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.
2004/03—2005/03Seoul National University of Korea Microelectronics Others
I had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.
2001/03—2004/03Shanghai Institute of Microsystemsand Information Technology,Chinese Academy of Sciences InformationTechnology Doctorate
1998/09—2001/03Nanjing University of Science & Technology Material Science and Engineering Master
Being a master student of this period, I have published one EI paper about Super-fine metal powers electrical characteristics.
1993/09—1997/07Nanjing University of Science & Technology Material Science and Engineering Bachelor
1997/07—1998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department
Professional Skills
Language Skills:English: EXCELLENT

Korean:AVERAGE

Computer Skills:Technology skilled 96Month

SAPunderstanding 8Month

Certificate:2000/11MCSE

1999/06CET6

Self-appraisal
7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.

第3篇:IT经理英文简历表格

IT经理英文简历表格

求职者在编写个人简历时,需要针对求职的职位来写,能够让用人单位录取要求求职的职位于个人的能力相符合。比如说,求职者的应聘职位是人力资源部主管,那么就要有人力资源管理专业能力以及经验。 在企业中主管是属于中层管理者,对人才的实力要求比较高,如果实力不够即便个人简历写的再漂亮也不能被录用。

在一次求职中不一定就只能应聘一个职位,能力高的人才可以一次应聘两个或是三个职位,像是计算机专业、会计专业、金融专业等等这种综合性质的`专业,其应用领域广,同时应聘两个职位也可以提高通过率。不过,在应聘职位上要有关联性,不能跨度过大,例如企业中的生产技术部职位与市场营销部的职位差别就很大。

求职者在编写个人简历的时候,其应聘的职位要写清楚,同时还要注意于工作经历之间的联系,在某项职位上的才能可以通

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